System for reclamation of waste thermal energy

ABSTRACT

A waste heat reclamation device absorbs waste heat from a heat generating object. A thermocouple loop is used to convert thermal energy into electrical energy which may be utilized to provide electrical power to an electronic device that is the heat generating object. The invention increases the efficiency of electronic devices such as computer processing units.

CROSS-REFERENCE TO RELATED APPLICATIONS

This Patent claims the benefit of U.S. Provisional Application No.60/981,149 filed Oct. 19, 2007.

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

None

REFERENCE TO SEQUENCE LISTING, A TABLE, OR A COMPUTER PROGRAM LISTINGCOMPACT DISC APPENDIX

None

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an apparatus and method for capturingenergy from waste heat generated by an electrical system. Specifically,the present invention provides a device for use in conjunction with orin place of a heat sink that absorbs thermal energy radiating fromelectrical components and converts this heat into useful electricalpower.

2. Prior Art

The two dominant trends in computer processing today are toward reducingphysical size and increasing processing speeds. The need for convenienceand portability continues to drive electronic designers to smaller andmore densely organized circuitry. The need for faster and increasinglycomplex and simultaneous calculations continues to push the industrytoward faster computational speeds and data processing. These trendsconverge in smaller, denser circuitry that also inherently results infaster processing speeds. Unfortunately, these trends also produce somenegative results. Higher processing speed requires greater currentdemands while size reduction results in greater resistivity in thecircuits. These stronger currents, pushing through more resistivecircuits, result in the radiation and convection of substantial amountsheat that both wasted and potentially damaging.

Unchecked, this heat can damage and ruin circuits and other componentsof a central processing unit. Waste heat also significantly affects thecost of operating computer processors. The heat so generated is wasteenergy. As computers grow and use more energy, more heat is produced andmore energy wasted. This problem is compounded by the fact that it takesadditional energy to dispose of this waste energy.

It has become well known in the art to use heat sinks to remove wasteheat from processors, thereby preventing damage and allowing continuedhigh speed processing. Heat sink are constructed of thermally conductivemetals attached to a heat generating processor components and having aseries of protruding fins or other structure that facilitates andmaximizes rapid heat dissipation. These are often used in conjunctionwith fans. Liquid cooling has become more common especially with largedata processing centers. And more recently, gas expansion coolers andthermoelectric Peltier coolers have been developed for cooling entireprocessing units as well as local hot spots. Companies have begundeveloping small chips that convert thermal energy to electricity inorder to recover waste heat. Some purport to function at 70-80% of theCarnot cycle theoretical efficiency for heat pumps. In general,utilizing wasted heat has been a focus of research into thermoelectricconverters which rely upon the Seebeck effect. Further, organicthermoelectric materials have been discovered.

Although various heat sinks allow continuous high running speeds ofcomputer circuitry by dissipating waste heat, they create problems oftheir own. The heat sinks themselves take up space and thereforeincrease the overall size of a computer processing unit. They increasethe amount of power a computer processor or system requires to removethe wasted heat. This results in computers that require more energy andtherefore become less efficient. Furthermore, the addition of heat sinkcomponents further complicates the manufacture of computer processorsand adds to their maintenance requirements. That is, as cooling devicesbecome more sophisticated, they also become more complicated anddifficult to maintain.

It is therefore desirable to provide a simple, low cost method fordissipating heat from electronic circuitry.

It is also desirable to provide a means for reclaiming waste heat energyfrom electronic circuitry and It is also desirable to provide a meansfor increasing the overall efficiency of a computer processor. Theinstant invention addresses these long felt needs in the art.

BRIEF SUMMARY OF THE INVENTION

The present invention provides an apparatus and method for improving theefficiency of electrical devices by reclaiming otherwise wasted heatenergy to provide electrical power. Waste thermal energy, i.e., heatgenerated by data processing and storage centers is harnessed andconditioned into usable electrical energy. This harvested thermal energyis converted into electrical energy which may then be fed into a mainpower bus of a data processing unit.

The invention overcomes difficulties in the prior art by convertingwaste heat into electric current that may be recycled for use as a powersource for the electronic device the heat is reclaimed from. Potentiallydamaging waste heat is removed from sensitive electronic circuitry byabsorption by a thermocouple device. By reclaiming waste thermal energyusing thermocouples, the invention improves the efficiency of electronicdevices such as computer processors. The thermocouple device so utilizedis preferably small and substantially planar. Therefore, it does not addsubstantial volume to the overall size of a processing unit to which itis added.

Existing heat sinks remove damaging waste heat by dissipating it intothe atmosphere. The present invention removes the waste heat fromelectrical components by absorbing, harnessing and recycling the thermalenergy and converting it to electric power. The electric currentgenerated by the harnessed thermal energy is properly conditioned by thepresent invention and fed into a power supply or a power supply bus. Inthis fashion, the present invention both cools electrical systems andincreases efficiency. The preferred embodiment of the invention may beretrofitted into existing computer processing or other units and operatein conjunction with existing heat sinks and cooling systems. Theinvention may not completely eliminate the need for conventional meansof managing waste heat. The extent to which conventional waste heatmanagement technologies will still be relied on will depend on theamount of heat generated, the efficiency of the thermocouple device andother factors known in the art.

Preferably, the invention utilizes a thermocouple device either alone orin conjunction with a heat sink. The thermocouple device is placed inthermal contact with a heat-generating component of a processing,storage or other electronic device. Those skilled in the art willappreciate that the Seebeck effect will induce an electric current in athermocouple that has been put in contact with a heat-generating object.The current generated within the thermocouple may be routed through apower conditioner and used to supply power to an electronic device.Typically, the power conditioner includes a diode OR circuit so that itmay be properly conditioned for use as a power source for the processor.Those of skill in the art will appreciate that a diode OR circuit orequivalent device will allow current supplied by the thermocouple tocommunicate with a power supply to feed a current proportional to theheat absorbed back to the processor. It is preferred to use an apparatusfor properly conditioning the current generated by the thermocouplebecause the generated current will fluctuate, especially when power isinitially supplied to the heat generating system.

The invention may alternatively be embedded directly into a heatgenerating electrical component during fabrication such that thecomponent has a self-contained thermal recovery feature and thus loweroverall waste heat output and reduced power consumption.

It is an object of the present invention to provide a means forabsorbing waste heat and converting it into usable electrical energy.

There has thus been outlined, rather broadly, the more importantfeatures of the invention in order that the detailed description thereofthat follows may be better understood, and in order that the presentcontribution to the art may be better appreciated. There are features ofthe invention that will be described hereinafter and which will form thesubject matter of the claims appended hereto.

In this respect, before explaining at least one embodiment of theinvention in detail, it is to be understood that the invention is notlimited in its application to the details of construction and to thearrangements of the components set forth in the following description orillustrated in the drawings. The invention is capable of otherembodiments and of being practiced and carried out in various ways.Also, it is to be understood that the phraseology and terminologyemployed herein are for the purpose of description and should not beregarded as limiting.

As such, those skilled in the art will appreciate that the conception,upon which this disclosure is based, may readily be utilized as a basisfor the designing of other structures, methods and systems for carryingout the several purposes of the present invention. It is important,therefore, that the claims be regarded as including such equivalentconstructions insofar as they do not depart from the spirit and scope ofthe present invention.

Further, the purpose of the foregoing abstract is to enable the U.S.Patent and Trademark Office and the public generally, and especially thescientists, engineers and practitioners in the art who are not familiarwith patent or legal terms or phraseology, to determine quickly from acursory inspection the nature and essence of the technical disclosure ofthe application. The abstract is neither intended to define theinvention of the application, which is measured by the claims, nor is itintended to be limiting as to the scope of the invention in any way.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a flow chart of energy flow through a typical computerprocessing system incorporating the present invention.

FIG. 2 is an embodiment of the invention.

FIG. 3 is an alternative embodiment of the invention.

FIG. 4 is a typical diode OR circuit of the invention.

FIG. 5 is an alternative embodiment of the invention.

FIG. 6 is an alternative embodiment.

DETAILED DESCRIPTION OF THE INVENTION

Referring now to the drawings, FIG. 1 shows a flow chart of energythrough an electrical computer processor and the invention. Electricpower 8 from an outside source is introduced to the processing unit'spower supply 10 which is then distributed to various components within acentral processor unit 12 by a power distribution bus 20. Those skilledin the art will appreciate that computer processors typically include apower source 10 that conditions an outside power source to provideappropriate current for various components of the central processingunit (CPU) 12. Those of skill in the art will appreciate that a powersupply 10 is typically connected to the central processing unit 12 by apower supply bus 20 that distributes the electric current from powersupply 10 to various and sundry electrical components of the centralprocessing unit 12.

Many of the components of CPU 12 will generate a substantial amount ofwaste heat 18 as current passes through them. This heat 18 is usuallyconducted to a heat sink which is generally comprised of a metal platehaving thermal conductivity and a distinct geometry. This highlyconductive metal plate removes a substantial amount of waste heat fromvarious components of the CPU 12. A series of fins extend outwardly fromthe heat sink increasing surface area and thereby facilitating morerapid dissipation of excess heat into the ambient air. Heat may also beremoved from the heat sink by other devices such as, but not limited to,heat pipes, liquid cooling systems, air cooling systems, Peltiercoolers, gas expansion coolers, electric coolers and the like.

In the instant invention, waste heat 18 is transferred, typicallythrough a heat sink, to a waste heat harnessing device 14. In thisparticular embodiment, waste heat harnessing device 14 comprises athermocouple. When heat is applied to one side of the thermocouple, aheat gradient is formed across it thereby inducing an electric current.This electric current 22 may be readily transferred to a powerconditioner 16. Current 22 arrives at power conditioner 16 fluctuatingand unsteady. Power conditioner 16 conditions the recaptured current 22into a constant, steady current and a desired voltage. The nowconditioned current 24 is fed back into the power supply 10. Thoseskilled in the art will appreciated that conditioned, reclaimed energy24 may similarly be fed to the main power bus 20 or directly to one ofthe components of CPU 12.

FIG. 2 shows a waste heat reclamation system of the present invention ofFIG. 1. The waste heat reclamation system comprises a waste heatharnessing device 36 and a current condition device 30. Device 36 is inthermal contact with a heat generating electrical means 32. Those ofskill in the art will appreciate that a wide variety of objects,electrical and otherwise, generate excess heat. If this heat is notremoved, it may damage, destroy, or reduce the efficiency of a heatgenerating means 32, as well as other components proximal to the heatgenerating means 32 which may include any of a wide variety ofelectrical components, including, but not limited to, an integratedcircuit, a microprocessor, a semiconductor, an electric motor, a memorystorage device, an electrical or computing bus, combinations thereof andthe like.

Heat generating means 32 is in thermal communication with heat sink 34.It preferably is substantially planar and comprised of a thermallyconductive material such as a metal including copper, aluminum or thelike. Heat sink 34 is preferably secured to heat generating component 32by a thermally conductive epoxy resin or other adhesive. It mayalternatively be attached by mechanical or other means, so long as it isin thermally conductive contact.

The waste heat harnessing device 36 in this embodiment is a typicalthermocouple, well known in the art. Thermocouple 36 includes athermocouple loop having a first conductor 38 and a second conductor 40.Junction 44 is an electrically conductive material in contact withconductors 38 and 40. Junction 44 is also attached to heat sink 34 by athermally conducive and electronically insulating layer 45. Thoseskilled in the art will appreciate that it is preferable that the onlyportion of thermocouple 36 in electrically conductive contact with anyobject are leads 39 and 41 which are attached to conducting wires 48 and46 respectively. Any objects in electrically conductive contact withthermocouple 36 other than conducting wires 48 and 46 may decrease thecurrent transferred to conditioner 30, thereby decreasing the efficiencyof the waste heat reclamation device 30. Electrically insulating layer43 covers leads 39 and 41.

As the waste heat generating component 32 is actuated, heat is createdand transferred from it into heat sink 34. Waste heat is thentransferred through electrically insulating, thermally conductive layer45 into junction 44. This creates a temperature differential betweenjunction 44 and leads 39 and 41. Because conductors 38 and 40 arecomprised of different conducting material, the heat differentialinduces the Seebeck effect in the thermocouple 36. This results in anelectric current flowing through leads 39 and 41 into conducting wires48 and 46 respectively. The current induced in the thermocouple 36 istransferred to the energy conditioner 30 by wires 46 and 48. Conditioner30 is fed a current from a power source (not shown) by wires 52 and 54.The variable current supplied by thermocouple 36 to the conditioner 30is combined with a variable amount of power from wires 52 and 54 suchthat it may provide a stable, continuous, output current through outputwires 56 and 58. The output current generated by conditioner 30 may beused to supply power to a power bus within a computer processing unit orany other suitable component.

FIG. 3 shows a second embodiment of the invention that maximizes theheat differential within the thermocouple 78. Waste heat reclamationdevice 70 thereof includes a thermocouple 78 and a conditioning unit100. Thermocouple 78 has a first conductor 80 and a second conductor 82joined by junction 77. As with the embodiment of FIG. 2, junction 77 isbound to heat sink 74 by a thermally conductive but electricallyinsulating layer 76. Heat sink 74 is thermally conductively attached towaste heat generating component 72. Leads 84 and 90 connect thermocouple78 to conducting wires 94 and 96 to conduct a current to conditioningunit 100. The current so supplied to conditioning unit 100 bythermocouple 78, through conducting wires 96 and 94, is conditioned toprovide a constant current to outputs lines 104 and 106. Power Lines 98and 102 provide additional power to conditioning unit 100 as needed toconvert the varying current supply by thermocouple 78 into a morestable, steady current.

Thermocouple 78 has an outer insulating layer 86. Heat sink 88 isthermally conductively attached to electrically insulating and thermallyconductive layer 86. Heat sink 88 exhibits a plurality of fins 89 thatfacilitate dissipation of heat. Fan 92 works in conjunction with heatsink 88 by blowing air across fins 89 to effect cooling by convection.

As heat is continuously transferred from component 72 through heat sink74 and into junction 77 of thermocouple 78, heat will gradually movethrough conductors 80 and 82 and gradually reduce the heat differentialacross the thermocouple. This in turn reduces the current generated bythermocouple 78 and fed into conditioning unit 100. Heat sink 88 and fan92 help to maintain an optional temperature differential acrossthermocouple 78. The embodiments shown in FIG. 2 and FIG. 3 may bereadily incorporated into existing CPUs by simply retrofitting existingheat sinks.

FIG. 4 shows a third embodiment in the form of a typical conduction unit120 for use in the invention. Conduction unit 120 is comprised of adiode OR 122. A suitable such diode is made by Linear Technology Corpand sold as chip LTC 4412. A power supply is fed into input 136 of diodeOR 122 through conducting wires 126 and 124. Diode OR 122 is alsoconnected to a thermocouple waste heat reclamation device by means ofconducting wires 128 and 130 at input 138. Diode OR 122 supplies aconstant, steady current to wires 132 and 134 at output 140 so long ascurrent is provided at least from the power source feeding input 136. Ascurrent is fed into diode OR 122 through input 138, the amount ofcurrent the diode OR 122 accepts through input 136 decreasesaccordingly. The current provided through output 140 is always equal tothe sum of the inputs received from inputs 136 and 138. In this fashion,conditioning unit 120 maintains a constant and stable output currentstrength.

FIG. 5 shows a fourth embodiment of a waste heat harnessing device 150of the present invention. In this embodiment, waste heat harnessingdevice 152 is a thermocouple device having a series of thermocoupleswithin it. This is a relatively common configuration for thermocoupledevices. It is well know in the art to combine two or more thermocouplesinto a series of many thermocouples in much the same way the electricbatteries are placed in series. Heat harnessing device 152 is attachedby means of thermally conductive electrically insulating layer 174 toheat sink 166 which is attached to waste heat generating device 164.Heat sink 166 is also attached in a thermally conductive way to heatdissipating device 168 having a plurality of fins 170. There exist manyheat sinks which themselves have a series of fins extending outwardlyfrom them instead of a separate heat dissipating device attached to it.Fan 172 in this embodiment aids in the dissipating of heat through fins170 and also helps to maintain the maximum thermal differential withinthe heat harnessing device 152. Conducting wires 154 and 156 areattached to leads 160 and 162 within the heat harnessing device to carrycurrent through a conditioning unit not shown. The heat harnessingdevice 152 includes an exterior thermally conductive layer 158 that actsas a heat sink. Alternating columns of conducting materials 178 and 176are connected by junctions 180 to produce a thermocouple series. As heatis transferred from object 154 through heat sink 166 to the heatharnessing device 152, the Seebeck effect generates a current throughdevice 152 and into conducting wires 154 and 156. FIG. 5 illustratesthat the present invention may not only be readily retrofitted throughexisting heat generating components but may be used in combination withexisting methods of dissipating waste heat.

FIG. 6 shows a fifth embodiment, namely a of the heat harnessing device200. Device 200 is attached to heat sink 204 which is attached to heatgenerating device 202. Heat harnessing device 200 comprises severalthermocouple series devices 206 stacked together. Each thermocoupledevice 206 consists of a series of thermocouples connected horizontallysimilarity to the device 152 shown in FIG. 5. By stacking several ofthese thermocouple series devices 206 into one large thermocouple pile,more heat energy may be harnessed and converted into electric current byharnessing device 200. The current generated is then carried through aconditioning unit, not shown through wires 208 and 210.

FIGS. 5 and 6 illustrate that a variety of thermocouple geometries maybe utilized to harness wasted heat energy from various heat generatingdevices. Which geometry is most applicable depends on the amount of heatgenerated, the available surface area available for attachment of theharnessing device, the volumetric space surrounding the heat generatingdevice, and various other factors appreciated by those of skill in theart.

Whereas, the present invention has been described in relation to thedrawings attached hereto, it should be understood that other and furthermodifications, apart from those shown or suggested herein, may be madewithin the spirit and scope of this invention. Descriptions of theembodiments shown in the drawings should not be construed as limiting ordefining the ordinary and plain meanings of the terms of the claimsunless such is explicitly indicated.

1. A waste heat reclamation system, comprising: (a) a waste heatharnessing device including a means for converting thermal energy intoan electric current; and (b) a current conditioning device includingmeans of conditioning a variable current into a stable and constantelectric current, in which heat harnessing device is in electricalconductive communication with said current conditioning device.
 2. Thewaste reclamation system of claim 1, in which said waste heat harnessingdevice comprises a solid state device having no moving parts.
 3. Thewaste reclamation system of claim 1, in which said means for convertingthermal energy into an electric current comprises at least onethermocouple device.
 4. The waste reclamation system of claim 1, inwhich said means for conditioning a variable current comprises a diodeOR circuit.
 5. The waste reclamation system of claim 4, in which diodeOR defines input of electric current from a power supply.
 6. A wasteheat reclamation device, comprising: (a) a plurality of waste heatharnessing devices, each defining means for converting thermal energyinto an electric current; and, (b) at least one current conditioningdevice comprising means for conditioning a variable current into astable and constant electric current, said plurality of heat harnessingdevices disposed in electrically conductive communication with saidcurrent conditioning device.
 7. A method for reclaiming waste heat froma waste heat generating device, the method comprising the steps of: (a)generating an electric current by placing a waste heat harnessing devicein thermally conductive communication with a waste heat generatingdevice wherein the waste heat harnessing device comprises a means forconverting thermal energy into an electric current; (b) supplying theelectric current to a current conditioning device; and (c) conditioningthe electric current such that the electric current is constant andstable.
 8. The method of claim 7 further comprising: supplying theconditioned electric current to a power supply for an electrical device.9. The method of claim 7, in which the step of conditioning the electriccurrent comprises the step of feeding the current to a diode OR circuit.